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Jitter, Noise, and Signal Integrity at High-Speed List Price: $110.00 Sale Price: $79.98 |
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State-of-the-art JNB and SI Problem-Solving: Theory, Analysis, Methods, and Applications Jitter, noise, and bit error (JNB) and signal integrity (SI) have become today‘s greatest challenges in high-speed digital design. Now, there’s a comprehensive and up-to-date guide to overcoming these challenges, direct from Dr. Mike Peng Li, cochair of the PCI Express jitter standard committee. One of the field’s most respected experts, Li has brought together the latest theory, analysis, methods, and practical applications, demonstrating how to solve difficult JNB and SI problems in both link components and complete systems. Li introduces the fundamental terminology, definitions, and concepts associated with JNB and SI, as well as their sources and root causes. He guides readers from basic math, statistics, circuit and system models all the way through final applications. Emphasizing clock and serial data communications applications, he covers JNB and SI simulation, modeling, diagnostics, debugging, compliance testing, and much more. Coverage includes JNB component classification, interrelationships, measurement references, and transfer functions Statistical techniques and signal processing theory for quantitatively understanding and modeling JNB and related components Jitter, noise, and BER: physical/mathematical foundations and statistical signal processing views Jitter separation methods in statistical distribution, time, and frequency domains Clock jitter in detail: phase, period, and cycle-to-cycle jitter, and key interrelationships among them PLL jitter in clock generation and clock recovery Jitter, noise, and SI mechanisms in high-speed link systems Quantitative modeling and analysis for jitter, noise, and SI Testing requirements and methods for links and systems Emerging trends in high-speed JNB and SI As data rates continue to accelerate, engineers encounter increasingly complex JNB and SI problems. In Jitter, Noise, and Signal Integrity at High-Speed, Dr. Li provides powerful new tools for solving these problems–quickly, efficiently, and reliably. Preface xv Acknowledgements xxi About the Author xxiii Chapter 1: Introduction 1 Chapter 2: Statistical Signal and Linear Theory for Jitter, Noise, and Signal Integrity 27 Chapter 3: Source, Mechanism, and Math Model for Jitter and Noise 75 Chapter 4: Jitter, Noise, BER (JNB), and Interrelationships 109 Chapter 5: Jitter and Noise Separation and Analysis in Statistical Domain 131 Chapter 6: Jitter and Noise Separation and Analysis in the Time and Frequency Domains 163 Chapter 7: Clock Jitter 185 Chapter 8: PLL Jitter and Transfer Function Analysis 209 Chapter 9: Jitter and Signal Integrity Mechanisms for High-Speed Links 253 Chapter 10: Modeling and Analysis for Jitter and Signaling Integrity for High-Speed Links 281 Chapter 11: Testing and Analysis for Jitter and Signaling Integrity for High-Speed Links 309 Chapter 12: Book Summary and Future Challenges 345 Index 353 |
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ALTERA MAX II CPLDS REDUCE PCI SYSTEM COSTS.: An article from: Electro Manufacturing List Price: $5.95 Sale Price: $5.95 |
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This digital document is an article from Electro Manufacturing, published by Worldwide Videotex on August 1, 2004. The length of the article is 699 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.Citation DetailsTitle: ALTERA MAX II CPLDS REDUCE PCI SYSTEM COSTS.Publication: Electro Manufacturing (Newsletter)Date: August 1, 2004Publisher: Worldwide VideotexVolume: 17 Issue: 8 Page: NADistributed by Thomson Gale |
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ALTERA SHOWCASES EMBEDDED NETWORKING/MOTOR CONTROL.: An article from: UNIX Update List Price: $9.95 Sale Price: $9.95 |
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This digital document is an article from UNIX Update, published by Worldwide Videotex on December 1, 2010. The length of the article is 368 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available immediately after purchase. You can view it with any web browser.Citation DetailsTitle: ALTERA SHOWCASES EMBEDDED NETWORKING/MOTOR CONTROL.Author: UnavailablePublication: UNIX Update (Newsletter)Date: December 1, 2010Publisher: Worldwide VideotexVolume: 21 Issue: 12 Page: NADistributed by Gale, a part of Cengage Learning |
Frbiz.com reports TSMC reported that additional capital expenditures will be expansion
According to Taiwan media reports, the experts expected, due next year, TSMC bullish IDM (integrated device manufacturing) plant expansion commissioned foundry, TSMC is likely to rise again at the end of this year's capital expenditure budget to 2.5 billion ~ 30 billion U.S. dollars.
TSMC to spend money expansion is not soft, as optimistic about next year's expansion of IDM works commissioned by OEM, and following the advanced 65-nanometer production technology in short supply, TSMC announcement this year to obtain a total investment of equipment and plant such as the amount of more than 70 billion NT yuan (about 2.1 billion to 2.2 billion U.S. dollars), rated for 2.3 billion U.S. dollars this year, capital expenditures have almost been exhausted. Industry insiders estimate that TSMC is likely to rise again at the end of this year's capital expenditure budget to 25 billion to three billion U.S. dollars or more, and next year's capital expenditure may be adjusted upwards to 3.5 billion to 40 billion U.S. dollars.
Although the market for chip foundries in the fourth quarter and next year's first quarter orders are still concerns, but like TSMC to spend money like water expansion action is completely contrary to equipment manufacturers is expected, and Taiwan Semiconductor Manufacturing Company continued to application of at least materials, KLAC (KLA Tencor), the power of science and technology pioneer, Tokyo (Tokyo Electron), Esko Moore (ASML) and other equipment factory, a big buyer of 45/40 nano-devices, hope by the end of monthly production capacity of up to 35000 more than the size.
If, according to TSMC, since the announcement in April to obtain the equipment and plant services and other expenses the amount of people indeed breathtaking, the whole amount of investment has more than 700 million Taiwan dollars, equivalent to approximately U.S. 2.1 billion to 2.2 billion U.S. dollars. As TSMC by the end of July in France said they would before this year's capital expenditure budget will be raised 2.3 billion U.S. dollars, this point of view, TSMC at the end of France that it would inevitably again in overweight, equipment manufacturers forecast, capital Expenditure is expected to reach 2.5 billion to 2.8 billion U.S. dollars, and orders in the first quarter of next year if the estimate is not weak, but also may point of view three billion U.S. dollars.
Of course, TSMC will be so positive expansion, seems to imply that the 45/40 nm orders received soft, because it has been mass production at TSMC's customers, including programmable logic devices (FPGA) Plant Altera (Altera) , graphics chip duo Ying Hill & Knowlton (NVIDIA) and the AMD / ATI, and commissioned the production TSMC 16-core processor Sun system, Rainbow Falls and so on.
In addition, the end of the year, including Qualcomm (Qualcomm), Marvell, NetLogic chip manufacturers such as mobile phones and China Netcom, some 45/40 nanometer chips will also be finalized to complete the design (tape-out), since the mass production of cast films of next year. More importantly, part of Intel's Atom commissioned by TSMC foundry core system-on-chip, will begin production at the end of the first quarter of next year, next year will be eaten by a large number of TSMC's 45 nm advanced process capacity.
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Semiconductor Industry Association Chairman to Address the Industry's Future During State of the Industry Address
WASHINGTON----SIA Chairman John Daane, CEO, president, and Chairman of Altera Corporation, will present an up-to-date report on the state of one of America’s most strategically important industries.
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